Ivankovic, AndrejAndrejIvankovicVan der Plas, GeertGeertVan der PlasMoroz, V.V.MorozChoi, M.M.ChoiCherman, VladimirVladimirChermanMercha, AbdelkarimAbdelkarimMerchaMarchal, PolPolMarchalGonzalez, MarioMarioGonzalezEneman, GeertGeertEnemanZhang, WenqiWenqiZhangBuisson, ThibaultThibaultBuissonDetalle, MikaelMikaelDetalleLa Manna, AntonioAntonioLa MannaVerkest, DiederikDiederikVerkestBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneVandevelde, BartBartVandeveldeDe Wolf, IngridIngridDe WolfVandepitte, DirkDirkVandepitte2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20852Analysis of microbump induced stress effects in 3D stacked IC technologiesProceedings paper