Radisic, AlexAlexRadisicNagar, MagiMagiNagarStrubbe, K.K.StrubbeArmini, SilviaSilviaArminiEl-Mekki, ZaidZaidEl-MekkiVolders, HennyHennyVoldersRuythooren, WouterWouterRuythoorenVereecken, PhilippePhilippeVereecken2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17865Copper plating on resistive substrates, diffusion barrier and alternative seed layersProceedings paper