Process induced sub-surface damage in mechanically ground silicon wafers

Yang, YuYuYangDe Munck, KoenKoenDe MunckCotrin Teixeira, RicardoRicardoCotrin TeixeiraSwinnen, BartBartSwinnenVerlinden, BertBertVerlindenDe Wolf, IngridIngridDe Wolf2021-10-172021-10-172008-070268-1242https://imec-publications.be/handle/20.500.12860/14812Process induced sub-surface damage in mechanically ground silicon wafersJournal articlehttp://iopscience.iop.org/0268-1242/23/7/075038/