A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

Travaly, YoussefYoussefTravalyTsutsue, M.M.TsutsueIkeda, AtsushiAtsushiIkedaVerdonck, PatrickPatrickVerdonckTokei, ZsoltZsoltTokeiWillegems, MyriamMyriamWillegemsVan Aelst, JokeJokeVan AelstStruyf, HerbertHerbertStruyfVereecke, GuyGuyVereeckeKesters, ElsElsKestersLe, Quoc ToanQuoc ToanLeClaes, MartineMartineClaesHeylen, NancyNancyHeylenSinapi, FabriceFabriceSinapiRichard, OlivierOlivierRichardDe Roest, DavidDavidDe RoestKaneko, SSKanekoKemeling, NNKemelingFukazawa, AAFukazawaMatsuki, NNMatsukiMatsushita, KKMatsushitaTsuji, NNTsujiKagami, KKKagamiSprey, HesselHesselSpreyBeyer, GeraldGeraldBeyer2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/12990A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping filmOral presentation