Comparative study of 3D stacked IC and 3D interposer integration: processing and assembly challenges

De Vos, JoeriJoeriDe VosCherman, VladimirVladimirChermanDetalle, MikaelMikaelDetalleWang, TengTengWangSalahouelhadj, AbdellahAbdellahSalahouelhadjDaily, RobertRobertDailyVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/23734Comparative study of 3D stacked IC and 3D interposer integration: processing and assembly challengesProceedings paperhttp://ieeexplore.ieee.org/document/7152146/?arnumber=7152146