Vanden Bulcke, MathieuMathieuVanden BulckeIker, FrancoisFrancoisIkerDe Preter, IngeIngeDe PreterMuller, PhilippePhilippeMullerSoussan, PhilippePhilippeSoussanBeyne, EricEricBeyneVan Hoof, ChrisChrisVan HoofBaert, KrisKrisBaert2021-10-172021-10-172008-05https://imec-publications.be/handle/20.500.12860/14692Process technology for the fabrication of a chip-in-wire style packagingProceedings paper