Thermal resistance characterization of GaN power HEMTs on Si, SOI, and poly-AlN substrates

Magnani, AlessandroAlessandroMagnaniCosnier, ThibaultThibaultCosnierAmirifar, NooshinNooshinAmirifarZhao, MingMingZhaoLi, XiangdongXiangdongLiGeens, KarenKarenGeensDecoutere, StefaanStefaanDecoutere2022-01-272021-11-022022-01-272020naWOS:000618046600023https://imec-publications.be/handle/20.500.12860/38164Thermal resistance characterization of GaN power HEMTs on Si, SOI, and poly-AlN substratesProceedings paper978-1-7281-6049-8WOS:000618046600023HALF-BRIDGECIRCUITSDEVICES