Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via process

Kim, Soon-WookSoon-WookKimDetalle, MikaelMikaelDetallePeng, LanLanPengNolmans, PhilipPhilipNolmansHeylen, NancyNancyHeylenVelenis, DimitriosDimitriosVelenisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26831Ultra-fine pitch 3D integration using face-to-face hybrid wafer bonding combined with a via-middle through-silicon-via processProceedings paperhttp://ieeexplore.ieee.org/document/7545574/?arnumber=7545574