ESH friendly solvent for stripping positive and negative photoresists in 3D-wafer level packaging and 3D-stacked IC applications

Suhard, SamuelSamuelSuhardClaes, MartineMartineClaesCivale, YannYannCivaleNolmans, PhilipPhilipNolmansSabuncuoglu Tezcan, DenizDenizSabuncuoglu Tezcan2021-10-202021-10-2020121662-9779https://imec-publications.be/handle/20.500.12860/21569ESH friendly solvent for stripping positive and negative photoresists in 3D-wafer level packaging and 3D-stacked IC applicationsJournal article