A new scaled through Si via with polymer fill for 3D wafer level packaging

Sabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanDuval, FabriceFabriceDuvalLuhn, OleOleLuhnSoussan, PhilippePhilippeSoussanSwinnen, BartBartSwinnen2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14409A new scaled through Si via with polymer fill for 3D wafer level packagingProceedings paper