110GHz Through-Silicon Via's Integrated in Silicon Photonics Interposers for Next-Generation Optical Modules

Miyaguchi, KenichiKenichiMiyaguchiBan, YoojinYoojinBanPantano, NicolasNicolasPantanoSun, XiaoXiaoSunAbsil, PhilippePhilippeAbsilBogaerts, LieveLieveBogaertsVerheyen, PeterPeterVerheyenVelenis, DimitriosDimitriosVelenisPantouvaki, MariannaMariannaPantouvakiVan Campenhout, JorisJorisVan Campenhout2022-11-082022-07-312022-11-082021naWOS:000821936000094https://imec-publications.be/handle/20.500.12860/40189110GHz Through-Silicon Via's Integrated in Silicon Photonics Interposers for Next-Generation Optical ModulesProceedings paper10.1109/ECOC52684.2021.9605927978-1-6654-3868-1WOS:000821936000094