A new ultra-thin 3D integration technique: technological and thermal investigations

Pinel, StephaneStephanePinelTasselli, JosianeJosianeTasselliMarty, AntoineAntoineMartyBailbe, Jean-PierreJean-PierreBailbeBeyne, EricEricBeyneVan Hoof, RitaRitaVan HoofMarco, SantiagoSantiagoMarcoLeseduarte, SergioSergioLeseduarteVendier, OlivierOlivierVendierCoello Vera, AugustinAugustinCoello Vera2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4991A new ultra-thin 3D integration technique: technological and thermal investigationsProceedings paper