Experimental characterization of the vertical and lateral heat transfer in 3D stacked IC packages

Oprins, HermanHermanOprinsCherman, VladimirVladimirChermanVan der Plas, GeertGeertVan der PlasDe Vos, JoeriJoeriDe VosBeyne, EricEricBeyne2021-10-232021-10-232016-031043-7398https://imec-publications.be/handle/20.500.12860/27097Experimental characterization of the vertical and lateral heat transfer in 3D stacked IC packagesJournal articlehttp://electronicpackaging.asmedigitalcollection.asme.org/article.aspx?articleID=2503785