Hybrid copper dielectric direct bonding of 200mm CMOS wafers with five metal levels: morphologic, electrical and reliability characterization

Cavaco, CelsoCelsoCavacoPeng, LanLanPengGuerrieri, StefanoStefanoGuerrieriOsman, HarisHarisOsman2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/27985Hybrid copper dielectric direct bonding of 200mm CMOS wafers with five metal levels: morphologic, electrical and reliability characterizationProceedings paper