TCAD study of latch-up sensitivity to wafer thinning below 500 nm

Hiblot, GaspardGaspardHiblotSerbulova, KaterynaKaterynaSerbulovaHellings, GeertGeertHellingsChen, Shih-HungShih-HungChen2023-01-192022-09-252023-01-1920211545-827XWOS:000853482700023https://imec-publications.be/handle/20.500.12860/40509TCAD study of latch-up sensitivity to wafer thinning below 500 nmProceedings paper10.1109/CAS52836.2021.9604133978-1-6654-3571-0WOS:000853482700023