Novel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shift

Podpod, ArnitaArnitaPodpodPhommahaxay, AlainAlainPhommahaxayBex, PieterPieterBexKennes, KoenKoenKennesBertheau, JulienJulienBertheauArumugam, HariharanHariharanArumugamCochet, TomTomCochetRebibis, Kenneth JuneKenneth JuneRebibisSleeckx, ErikErikSleeckxMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33812Novel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shiftProceedings paperhttps://ieeexplore.ieee.org/document/8914144