Backside thinned CMOS imagers with high broadband quantum efficiency realised using a new integration process

De Munck, KoenKoenDe MunckBogaerts, JanJanBogaertsSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanDe Moor, PietPietDe MoorSedky, SherifSherifSedkyVan Hoof, ChrisChrisVan Hoof2021-10-172021-10-1720080013-5194https://imec-publications.be/handle/20.500.12860/13614Backside thinned CMOS imagers with high broadband quantum efficiency realised using a new integration processJournal article