Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking

Labie, RietRietLabieRuythooren, WouterWouterRuythoorenBaert, KrisKrisBaertBeyne, EricEricBeyneSwinnen, BartBartSwinnen2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13971Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stackingProceedings paper