3D IC interconnects: microbump yield electrical characterization and TSV modeling

Vakoula, PanagiotaPanagiotaVakoulaTyrovouzi, Anna-MariaAnna-MariaTyrovouziVelenis, DimitriosDimitriosVelenisStucchi, MicheleMicheleStucchiCroes, KristofKristofCroes2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/246593D IC interconnects: microbump yield electrical characterization and TSV modelingProceedings paper