Elastic electronic circuits and systems using moulded interconnect device (MID) technology

Vanfleteren, JanJanVanfleterenAxisa, FabriceFabriceAxisaBrosteaux, DominiqueDominiqueBrosteauxBossuyt, FrederickFrederickBossuytDe Leersnyder, EvaEvaDe LeersnyderVervust, ThomasThomasVervustHuyghe, BenoitBenoitHuygheMissinne, JeroenJeroenMissinneVerplancke, RikRikVerplanckeGonzalez, MarioMarioGonzalez2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14719Elastic electronic circuits and systems using moulded interconnect device (MID) technologyMeeting abstract