Carbonell, LaureLaureCarbonellCaluwaerts, RudyRudyCaluwaertsVolders, HennyHennyVoldersHeylen, NancyNancyHeylenKellens, KristofKristofKellensMertens, SofieSofieMertensVan Ammel, AnnemieAnnemieVan AmmelVan Roey, FriedaFriedaVan RoeyCockburn, AndrewAndrewCockburnGravey, VirgineVirgineGraveyShah, KavitaKavitaShahRajagopalan, RaviRaviRajagopalanTokei, ZsoltZsoltTokeiBeyer, GeraldGeraldBeyer2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/16823Metallization options for sub- 30 nm interconnects: comparison of Cu and W metallizationsOral presentation