3D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ring

Zhang, WenqiWenqiZhangMajeed, BivraghBivraghMajeedSun, XiaoXiaoSunPosada Quijano, GuillermoGuillermoPosada QuijanoDiekmann, C.C.DiekmannEggs, C.C.EggsSchmidhammer, E.E.SchmidhammerDe Raedt, WalterWalterDe Raedt2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/202143D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ringProceedings paper