Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis

Vandevelde, BartBartVandeveldeChristiaens, FilipFilipChristiaensBeyne, EricEricBeyneVan Puymbroeck, JanJanVan PuymbroeckHeerman, M.M.Heerman2021-09-302021-09-301997https://imec-publications.be/handle/20.500.12860/2267Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysisOral presentation