Nanotopography control for wafer-to-wafer hybrid bonding by CMP

Heylen, NancyNancyHeylenKim, Soon-WookSoon-WookKimKim, Tae-GonTae-GonKimPeng, LanLanPengNolmans, PhilipPhilipNolmansStruyf, HerbertHerbertStruyfMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, SofieSofieBeyne2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28500Nanotopography control for wafer-to-wafer hybrid bonding by CMPMeeting abstracthttp://conference.vde.com/icpt/cfp/Documents/ICPT%202017%20Program.pdf