Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm

Lin, YeYeLinBex, PieterPieterBexKennes, KoenKoenKennesDerakhshandeh, JaberJaberDerakhshandehDhakras, PrathameshPrathameshDhakrasSuhard, SamuelSamuelSuhardGerets, CarineCarineGeretsDewilde, SvenSvenDewildeGeorgieva, VioletaVioletaGeorgievaJourdain, AnneAnneJourdainBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2025-04-102024-12-072025-04-102024979-8-3503-7599-20569-5503WOS:001260983500007https://imec-publications.be/handle/20.500.12860/44954Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μmProceedings paper10.1109/ECTC51529.2024.00015979-8-3503-7598-5WOS:001260983500007