Electro-conductive adhesives for high density package and flip-chip interconnections

Wojciechowski, DominiqueDominiqueWojciechowskiVanfleteren, JanJanVanfleterenReese, E.E.ReeseHagedorn, H. W.H. W.Hagedorn2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4947Electro-conductive adhesives for high density package and flip-chip interconnectionsJournal article