Convolution based compact thermal model application to the evaluation of the thermal impact of die-die interface including interconnections

Maggioni, FedericaFedericaMaggioniOprins, HermanHermanOprinsBeyne, EricEricBeyneDe Wolf, IngridIngridDe WolfBaelmans, TineTineBaelmans2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24179Convolution based compact thermal model application to the evaluation of the thermal impact of die-die interface including interconnectionsProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6892270&contentType=Conference+Publications