Biswas, ChandanChandanBiswasGhosh, SouvikSouvikGhoshBrems, StevenStevenBremsLiechti, Kenneth M.Kenneth M.LiechtiAkinwande, DejiDejiAkinwande2026-10-282026-10-2820261748-3387https://imec-publications.be/handle/20.500.12860/60624Foundry-compatible transfer of two-dimensional materials is central to angstrom-era complementary FET logic, where atomically thin channels must be moved from growth wafers to target stacks without contamination, strain or interfacial damage. Scalable delamination, bonding and wafer-level metrology are needed to bridge lab-scale device performance with 300-mm CMOS manufacturing.engJournal article10.1038/s41565-026-02217-xWOS:001828627800001GRAPHENECOPPERMEDLINE:42486954