Four-point bending cycling as alternative for thermal cycling solder fatigue testing

Vandevelde, BartBartVandeveldeVanhee, FilipFilipVanheePissoort, DavyDavyPissoortDegrendele, LievenLievenDegrendeleDe Baets, JohanJohanDe BaetsAllaert, BartBartAllaertLauwaert, RalphRalphLauwaertLabie, RietRietLabieWillems, GeertGeertWillems2021-10-232021-10-232016-04https://imec-publications.be/handle/20.500.12860/27486Four-point bending cycling as alternative for thermal cycling solder fatigue testingProceedings paper