Okoro, ChukwudiChukwudiOkoroLimaye, PareshPareshLimayeAgarwal, RahulRahulAgarwalVandevelde, BartBartVandeveldeBeyne, EricEricBeyneVandepitte, DirkDirkVandepitte2021-10-192021-10-1920112156-3950https://imec-publications.be/handle/20.500.12860/19507Novel Cu-Cu bonding technique: the insertion bonding approachJournal article