Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects

De Vos, JoeriJoeriDe VosPeng, LanLanPengPhommahaxay, AlainAlainPhommahaxayVan Ongeval, JoostJoostVan OngevalMiller, AndyAndyMillerBeyne, EricEricBeyneKurz, FlorianFlorianKurzWagenleiter, ThomasThomasWagenleiterWimplinger, MarkusMarkusWimplingerUhrmann, ThomasThomasUhrmann2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26519Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnectsProceedings paperhttp://ieeexplore.ieee.org/document/7970002/