Van Dyck, RikRikVan DyckCasasola Paesa, MartaMartaCasasola PaesaEngelen, TineTineEngelenLuo, BinBinLuoBorgers, TomTomBorgersGovaerts, JonathanJonathanGovaertsSivaramakrishnan Radhakrishnan, HariharsudanHariharsudanSivaramakrishnan RadhakrishnanDaenen, MichaëlMichaëlDaenenPoortmans, JefJefPoortmansvan Vuure, Aart WillemAart Willemvan Vuure2024-04-292024-03-142024-04-2920230160-8371WOS:001151676200045https://imec-publications.be/handle/20.500.12860/43673Advanced Encapsulants for Reduced Thermal Mechanical Stress in Photovoltaic Modules: A Quantitative Analysis Using FBGSProceedings paper10.1109/PVSC48320.2023.10359569978-1-6654-6059-0WOS:001151676200045