Phommahaxay, AlainAlainPhommahaxayNakamura, AtsushiAtsushiNakamuraJourdain, AnneAnneJourdainVerbinnen, GreetGreetVerbinnenKamochi, YoshitakaYoshitakaKamochiKoyama, IchiroIchiroKoyamaIwai, YuYuIwaiSawano, MitsuruMitsuruSawanoTan, ShiroShiroTanMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerSleeckx, ErikErikSleeckxBeyne, EricEricBeyne2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25759Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removalProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7159785