Low damage etch approach of a new porous SiOC(H) Low-k dielectric

Van Aelst, JokeJokeVan AelstStruyf, HerbertHerbertStruyfDupont, TaniaTaniaDupontHendrickx, DirkDirkHendrickxTravaly, YoussefYoussefTravalyBoullart, WernerWernerBoullartVanhaelemeersch, SergeSergeVanhaelemeersch2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/11342Low damage etch approach of a new porous SiOC(H) Low-k dielectricProceedings paper