Test cost analysis for 3D die-to-wafer stacking

Taouil, MottaqiallahMottaqiallahTaouilHamdioui, SaidSaidHamdiouiBeenakker, KeesKeesBeenakkerMarinissen, Erik JanErik JanMarinissen2021-10-182021-10-182010-12https://imec-publications.be/handle/20.500.12860/18069Test cost analysis for 3D die-to-wafer stackingProceedings paper