300mm wafer level CVD-Mn/iodine-CVD-Cu-based metallization study for advanced copper interconnections

Jourdan, NicolasNicolasJourdanCellier, DanielDanielCellierVan Elshocht, SvenSvenVan ElshochtBoemmels, JuergenJuergenBoemmelsTokei, ZsoltZsoltTokei2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26792300mm wafer level CVD-Mn/iodine-CVD-Cu-based metallization study for advanced copper interconnectionsMeeting abstract