Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device

Wang, JunJunWangMannarino, ManuelManuelMannarinoVisker, JakobJakobViskerKang, ShuoShuoKangWeidlinger, GuntherGuntherWeidlingerWernicke, TobiasTobiasWernickeBurggraf, JurgenJurgenBurggrafWimplinger, MarkusMarkusWimplinger2025-04-162024-12-072025-04-162024979-8-3503-7599-20569-5503WOS:001260983500332https://imec-publications.be/handle/20.500.12860/44938Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS deviceProceedings paper10.1109/ECTC51529.2024.00342979-8-3503-7598-5WOS:001260983500332