Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding

Soussan, PhilippePhilippeSoussanHuyghebaert, CedricCedricHuyghebaertPhommahaxay, AlainAlainPhommahaxay2021-10-182021-10-182010-12https://imec-publications.be/handle/20.500.12860/18022Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bondingBook chapter