Study of the effect of grain boundary diffusion and Sn grain size on IMC morphology in solid state inter-diffusion soldering

Hou, LinLinHouMoelans, NeleNeleMoelansDerakhshandeh, JaberJaberDerakhshandehDe Wolf, IngridIngridDe WolfBeyne, EricEricBeyne2021-10-272021-10-2720192045-2322https://imec-publications.be/handle/20.500.12860/33168Study of the effect of grain boundary diffusion and Sn grain size on IMC morphology in solid state inter-diffusion solderingJournal article10.1038/s41598-019-51179-9