Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour

Heylen, NancyNancyHeylenLi, YunlongYunlongLiKellens, KristofKristofKellensTravaly, YoussefYoussefTravalyVereecke, GuyGuyVereeckeVolders, HennyHennyVoldersTokei, ZsoltZsoltTokeiVersluijs, JankoJankoVersluijsRip, JensJensRipVan Besien, ElsElsVan BesienCarbonell, LaureLaureCarbonellBeyer, GeraldGeraldBeyerFischer, PaulPaulFischerZhao, LarryLarryZhaoSantoro, GaetanoGaetanoSantoroCockburn, AndrewAndrewCockburnNguyen, OlivierOlivierNguyen2021-10-172021-10-172009https://imec-publications.be/handle/20.500.12860/15468Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviourProceedings paper