Ratchev, PetarPetarRatchevCarbonell, LaureLaureCarbonellHo, MengMengHoBender, HugoHugoBenderDe Wolf, IngridIngridDe WolfVerlinden, B.B.Verlinden2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6753Orientation imaging microscopy applications in Cu-interconnects and Cu-Cu wire bondingProceedings paper