Factors affecting an efficient sealing of porous low-K dielectrics by physical vapor deposition Ta(N) thin films

Iacopi, FrancescaFrancescaIacopiTokei, ZsoltZsoltTokeiLe, Quoc ToanQuoc ToanLeShamiryan, DenisDenisShamiryanConard, ThierryThierryConardBrijs, BertBertBrijsKreissig, U.U.KreissigVan Hove, MarleenMarleenVan HoveMaex, KarenKarenMaex2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6419Factors affecting an efficient sealing of porous low-K dielectrics by physical vapor deposition Ta(N) thin filmsJournal article