The impact of ash on TDDB of metal-hard-mask-etched Cu/low-k interconnects

Pantouvaki, MariannaMariannaPantouvakiStruyf, HerbertHerbertStruyfHendrickx, DirkDirkHendrickxHeylen, NancyNancyHeylenRichard, OlivierOlivierRichardBeyer, GeraldGeraldBeyer2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14269The impact of ash on TDDB of metal-hard-mask-etched Cu/low-k interconnectsMeeting abstract