High-throughput in-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding Applications

Tunca Altintas, BensuBensuTunca AltintasSaib, MohamedMohamedSaibMoussa, AlainAlainMoussaChew, Soon AikSoon AikChewZhang, BoyaoBoyaoZhangDe Vos, JoeriJoeriDe VosMiller, AndyAndyMillerBeyne, EricEricBeyneLorusso, GianGianLorussoCharley, Anne-LaureAnne-LaureCharleyBogdanowicz, JanuszJanuszBogdanowiczKasai, HiroakiHiroakiKasaiHasumi, KazuhisaKazuhisaHasumiMise, NobuyukiNobuyukiMiseOsaki, MayukaMayukaOsakiTanaka, MakiMakiTanaka2025-04-162025-02-152025-04-162024979-8-3503-9037-72687-9700WOS:001340802800142https://imec-publications.be/handle/20.500.12860/45208High-throughput in-line SEM Metrology for Cu Pad Nanotopography for Hybrid Bonding ApplicationsProceedings paper10.1109/ESTC60143.2024.10712138979-8-3503-9036-0WOS:001340802800142