Novel electroless bumping technologies for MCM-D: bumping of single chips and straight-wall bumping on cu metallisations

De Pauw, HerbertHerbertDe PauwVanfleteren, JanJanVanfleterenDe Baets, JohanJohanDe BaetsVan Calster, AndreAndreVan Calster2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5200Novel electroless bumping technologies for MCM-D: bumping of single chips and straight-wall bumping on cu metallisationsProceedings paper