On the impact of the edge profile of interconnects on the occurrence of passivation cracks of plastic-encapsulated electronic power devices

Ackaert, JanJanAckaertVanderstraeten, DanielDanielVanderstraetenVandevelde, BartBartVandevelde2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/18445On the impact of the edge profile of interconnects on the occurrence of passivation cracks of plastic-encapsulated electronic power devicesProceedings paper