A highly reliable 1×5μm via-last TSV module

Van Huylenbroeck, StefaanStefaanVan HuylenbroeckLi, YunlongYunlongLiDe Vos, JoeriJoeriDe VosJamieson, GeraldineGeraldineJamiesonTutunjyan, NinaNinaTutunjyanMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/32070A highly reliable 1×5μm via-last TSV moduleProceedings paperhttps://ieeexplore.ieee.org/document/8430389/