Investigation of solder joint deformation under thermo-mechanical loading using DIC techniques

Eichhorst, MichaelMichaelEichhorstSeiler, B.B.SeilerScheiter, L.L.ScheiterVandevelde, BartBartVandeveldeLauwaert, RalphRalphLauwaert2021-10-282021-10-282020https://imec-publications.be/handle/20.500.12860/35086Investigation of solder joint deformation under thermo-mechanical loading using DIC techniquesProceedings paper