Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding

Oprins, HermanHermanOprinsCherman, VladimirVladimirChermanWebers, TomasTomasWebersSalahouelhadj, AbdellahAbdellahSalahouelhadjKim, Soon-WookSoon-WookKimPeng, LanLanPengVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2021-10-232021-10-232016-05https://imec-publications.be/handle/20.500.12860/27098Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bondingProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7517703