Optimization of through Si via last microlithography for 3D packaging

Slabbekoorn, JohnJohnSlabbekoornTobback, BertBertTobbackVandeweyer, TomTomVandeweyerMiller, AndyAndyMillerFlack, WarrenWarrenFlackHsieh, RobertRobertHsiehKenyon, GarethGarethKenyon2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25924Optimization of through Si via last microlithography for 3D packagingProceedings paperhttp://www.iwlpc.com/files/IWLPC-2015-Program.pdf